Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

MLA

Wei Li, and Daquan Yu. “Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP.” Electronics; Volume 12; Issue 9; Pages: 2073, Apr. 2023. EBSCOhost, https://doi.org/10.3390/electronics12092073.

APA

Wei Li, & Daquan Yu. (2023). Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP. Electronics; Volume 12; Issue 9; Pages: 2073. https://doi.org/10.3390/electronics12092073

Chicago

Wei Li, and Daquan Yu. 2023. “Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP.” Electronics; Volume 12; Issue 9; Pages: 2073, April. doi:10.3390/electronics12092073.