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Lithography-free resistance thermometry based technique to accurately measure Seebeck coefficient and electrical conductivity for organic and inorganic thin films
- Source :
- Review of Scientific Instruments. 88:125112
- Publication Year :
- 2017
- Publisher :
- AIP Publishing, 2017.
-
Abstract
- We have developed a new and accurate technique to measure temperature dependent in-plane Seebeck coefficient and electrical conductivity of organic and inorganic thin films. The measurement device consists of one heater, two thermometers, and a four-probe configuration which is patterned on a substrate of choice using a simple shadow mask. The high resolution in temperature measurements and repeatability of resistance thermometry is leveraged while enabling simple implementation using only a shadow mask for patterning. We calibrate the technique using nickel and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) thin films. The error bar for the Seebeck coefficient is less than 1%, almost 10 times better than complementary techniques for thin films. Moreover, our method enables high-throughput characterization of thermoelectric properties of a variety of different large area inorganic and organic thin films that can be prepared by spin coating, drop casting, evaporation, sputtering, or any other growth technique and hence has potential for wide usage in the thermoelectrics and nanoscale transport community to study thin films.
- Subjects :
- Shadow mask
Spin coating
Materials science
business.industry
02 engineering and technology
010402 general chemistry
021001 nanoscience & nanotechnology
Thermoelectric materials
01 natural sciences
0104 chemical sciences
Sputtering
Seebeck coefficient
Thermoelectric effect
Optoelectronics
Resistance thermometer
Thin film
0210 nano-technology
business
Instrumentation
Subjects
Details
- ISSN :
- 10897623 and 00346748
- Volume :
- 88
- Database :
- OpenAIRE
- Journal :
- Review of Scientific Instruments
- Accession number :
- edsair.doi.dedup.....06c00b877eaa8c1dc98d8fc9934e37e4
- Full Text :
- https://doi.org/10.1063/1.5012039