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Qubit Device Integration Using Advanced Semiconductor Manufacturing Process Technology

Authors :
Roza Kotlyar
Payam Amin
Lieven M. K. Vandersypen
Singh Kanwaljit
Jessica M. Torres
G. Droulers
Matthew V. Metz
GertJan Eenink
R. Li
R. Pillarisetty
A. M. J. Zwerver
Thomas F. Watson
Nicole K. Thomas
Juan Pablo Dehollain
Jeanette M. Roberts
L. Massa
Christian Volk
Nodar Samkharadze
Menno Veldhorst
G. Zheng
J.M. Boter
Giordano Scappucci
D. Sabbagh
Lester Lampert
Patrick H. Keys
Brian Paquelet Wuetz
Hubert C. George
James S. Clarke
Source :
2018 IEEE International Electron Devices Meeting, IEDM 2018, 2018-December
Publication Year :
2018
Publisher :
IEEE, 2018.

Abstract

Quantum computing's value proposition of an exponential speedup in computing power for certain applications has propelled a vast array of research across the globe. While several different physical implementations of device level qubits are being investigated, semiconductor spin qubits have many similarities to scaled transistors. In this article, we discuss the device/integration of full 300mm based spin qubit devices. This includes the development of (i) a 28 Si epitaxial module ecosystem for growing isotopically pure substrates with among the best Hall mobility at these oxide thicknesses, (ii) a custom 300mm qubit testchip and integration/device line, and (iii) a novel dual nested gate integration process for creating quantum dots.

Details

Database :
OpenAIRE
Journal :
2018 IEEE International Electron Devices Meeting (IEDM)
Accession number :
edsair.doi.dedup.....05a39f20d1c27370acc5d8b8c2367194