Performance of LTCC embedded SiC gas sensors

A novel approach to encapsulation/packaging of SiC field effect transistor gas sensors for high temperature applications, such as exhaust and fuel gas emissions monitoring, based on direct co-firing of sensor devices and Low-Temperature Co-fired Ceramics (LTCC) has been investigated. Structural (SEM, EDX, XPS), electrical (I/V, C/V) as well as gas sensing characterization of packaged devices has shown that the “one-step” packaging process forms a hermetic package with retained transducer functionality and gas sensing characteristics without the need for any separate die attachment, (wire) bonding, and/or sealing of the package. Long-term stability testing at elevated temperatures of packaged devices has also shown promising results.