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A new face down bonding technique using a low melting point metal
- Source :
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 13:444-447
- Publication Year :
- 1990
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 1990.
-
Abstract
- A description is given of a face-down bonding technique, the low-melting-point metal connection (LMC) technique, for use in manufacturing liquid-crystal display (LCD) panels. By using a low melting point metal, such as an indium alloy, it is possible to connect the integrated circuit (IC) electrodes and bonding pads on a glass substrate at a temperature lower than 150 degrees C. First, using the dipping method, low-melting-point metal bumps were formed on the IC bonding pads with gold bumps. Shallow-bowl-shaped bumps, 10-20 mu m high, were the result. Next, the IC and the glass substrate were connected at a pressure of 30 gf/bump or less and a temperature of 150 degrees C or less. Two kinds of reliability tests were performed on this sample. One was a thermal shock test (TST): a repetition of -40 and 100 degrees C for 30 min each, for 300 cycles. The other was a high-temperature and high-humidity test: 70 degrees C, 90% relative humidity (RH) for 500 h. In both tests, stable results were obtained. Finally, dot matrix LCD panels, with 640*400 dots, were assembled with 20 driver IC chips. The panels displayed test patterns perfectly. The LMC technique makes it easy to test and repair the IC bonds. The results of the trial manufacturing and testing show that the LMC technique can be readily applied in manufacturing LCD panels and many other kinds of electronic equipment. >
- Subjects :
- Thermal shock
Materials science
Liquid-crystal display
Alloy
General Engineering
chemistry.chemical_element
Integrated circuit
Substrate (electronics)
Polarizer
engineering.material
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials
law.invention
Metal
chemistry
law
visual_art
Dot matrix
Electrode
visual_art.visual_art_medium
engineering
Forensic engineering
Electrical and Electronic Engineering
Composite material
Indium
Subjects
Details
- ISSN :
- 01486411
- Volume :
- 13
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Accession number :
- edsair.doi.dedup.....013315269e454d4dbac06c444315d6da