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Aqueous Dissolution of Perovskite (CaTiO3): Effects of Surface Damage and [Ca2+] in the Leachant
- Source :
- Journal of Materials Research. 20:2462-2473
- Publication Year :
- 2005
- Publisher :
- Springer Science and Business Media LLC, 2005.
-
Abstract
- We have characterized thermally annealed perovskite (CaTiO3) surfaces, both before and after aqueous dissolution testing, using scanning electron microscopy, cross-sectional transmission electron microscopy, x-ray photoelectron spectroscopy, and atomic force microscopy. It was shown that mechanical damage caused by polishing was essentially removed at the CaTiO3 surface by subsequent annealing; such annealed samples were used to study the intrinsic dissolution behavior of perovskite in deionized water at RT, 90 °C, and 150 °C. Our results indicate that, although mechanical damage caused higher Ca release initially, it did not affect the long-term Ca dissolution rate. However, the removal of surface damage by annealing did lead to the subsequent spatial ordering of the alteration product, which was identified as anatase (TiO2) by both x-ray and electron diffraction, on CaTiO3 surfaces after dissolution testing at150 °C. The effect of Ca2+ in the leachant on the dissolution reaction of perovskite at 150 °C was also investigated, and the results suggest that under repository conditions, the release of Ca from perovskite is likely to be significantly slower if Ca2+ is present in ground water.
- Subjects :
- Anatase
Aqueous solution
Materials science
Scanning electron microscope
Mechanical Engineering
Mineralogy
Condensed Matter Physics
Chemical engineering
X-ray photoelectron spectroscopy
Electron diffraction
Mechanics of Materials
Transmission electron microscopy
General Materials Science
Dissolution testing
Dissolution
Subjects
Details
- ISSN :
- 20445326 and 08842914
- Volume :
- 20
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Research
- Accession number :
- edsair.doi...........ffc1b84be4f158a6f628cf9fa5213b01
- Full Text :
- https://doi.org/10.1557/jmr.2005.0294