Effect of the pulse plating parameters on the mechanical properties of nickel electrodeposits

Nanocrystalline nickel films have been prepared via pulse electrodeposition on steel substrates from an additive-free sulfamate-type bath. The mechanical properties of the films have been analyzed with respect to the parameters of various current programs. The mechanical properties of these films were determined using dynamic microindentation measurements known as the universal microhardness test. The hardness, plastic component, Young's modulus and percent of elastic recovery have been measured. Increasing the peak current density was more effective at improving the mechanical response of the films than varying the pulse-on time. In addition, X-ray diffraction studies have been performed to obtain the preferential orientation and grain size of the electrodeposits and scanning electron microscopy used to evaluate their morphology. All deposits exhibited a preferential orientation, and the highest performing films have been analyzed with respect to their mechanical properties. The effect of grain size, in the nanometer range, has been determined for variations in the microhardness with current density confirming the Hall–Petch relationship. These studies allow films to be tailored with good mechanical performance for various technological applications by simply selecting the appropriate electrodeposition conditions.