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Lithography Process Optimization for 3D and 2.5D Applications
- Source :
- International Symposium on Microelectronics. 2013:000790-000793
- Publication Year :
- 2013
- Publisher :
- IMAPS - International Microelectronics Assembly and Packaging Society, 2013.
-
Abstract
- Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.
Details
- ISSN :
- 23804505
- Volume :
- 2013
- Database :
- OpenAIRE
- Journal :
- International Symposium on Microelectronics
- Accession number :
- edsair.doi...........ff9f05f6450efbb2d72715d1bc0b1f27