Cite
Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
MLA
Tae-Kyu Lee, et al. “Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects.” Journal of Electronic Materials, vol. 43, Sept. 2013, pp. 69–79. EBSCOhost, https://doi.org/10.1007/s11664-013-2736-3.
APA
Tae-Kyu Lee, Choong-Un Kim, & Thomas R. Bieler. (2013). Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects. Journal of Electronic Materials, 43, 69–79. https://doi.org/10.1007/s11664-013-2736-3
Chicago
Tae-Kyu Lee, Choong-Un Kim, and Thomas R. Bieler. 2013. “Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects.” Journal of Electronic Materials 43 (September): 69–79. doi:10.1007/s11664-013-2736-3.