Magnetic field simulation of magnetic alignment technology for wafer bonding

Authors :: Lezhi Ye
Xuanjie Song
Yue Chang
Haiming Wang
Zhiyue Wang
Source :: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publication Year :: 2022
Publisher :: IEEE, 2022.

Database :: OpenAIRE
Journal :: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Accession number :: edsair.doi...........fe468acf49241275120292b2cf0f5f1b
Full Text :: https://doi.org/10.1109/icept56209.2022.9872632