Design of a versatile die placement system

The design of the versatile die placement system at Valtronic is described. The application of bare integrated circuits to a substrate (die attach) is one of the main operations of the technology. The modules produced by Valtronic (up to 40 different modules a month) can carry up to 20 different dice per substrate. Valtronic has a dedicated machine for its production which allows it to adapt to each product by using the best-suited form of die presentation while offering the ideal compromise between the automation required for the short and medium substrate runs. >