Failure analysis of fine Cu patterning by shave-off profiling

Authors :: A. Kameyama
Y. Kakuhara
Shinji Yokogawa
Masaaki Fujii
H. Tsuchiya
Masashi Nojima
Masanori Owari
Yoshimasa Nihei
Source :: Surface and Interface Analysis. 43:621-624
Publication Year :: 2010
Publisher :: Wiley, 2010.
Abstract: We focused on failure within fine copper patterning on a semiconductor chip. Three grades of samples were prepared; hard CMP treatment, soft CMP treatment and standard, and compared the differences by shave-off profiling. The shave-off profiles of CMP treatment revealed a saw-toothed structure, and the shave-off profile of a standard chip was revealed as a periodic triangular wave. The difference can be explained by the existence of residue on the CMP process. Copyright © 2010 John Wiley & Sons, Ltd.