IMPACT OF IMMERSION COOLING ON THERMOMECHANICAL PROPERTIES OF LOW-LOSS MATERIAL PRINTED CIRCUIT BOARDS

Authors :: Krishna Bhavana Sivaraju
A S M Raufur Chowdhury
Dereje Agonafer
Tushar Chauhan
Rabin Bhandari
Source :: Journal of Enhanced Heat Transfer. 28:73-90
Publication Year :: 2021
Publisher :: Begell House, 2021.

Subjects :: Fluid Flow and Transfer Processes
Printed circuit board
Materials science
Mechanical Engineering
Immersion (virtual reality)
Composite material
Condensed Matter Physics

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