(Invited) TmSiO as a CMOS-Compatible High-k Dielectric

Novel materials are being aggressively researched for integration in high-k/metal gate CMOS technology, as innovations in the gate stacks are necessary to sustain scaling toward the end of the roadmap. In this paper, we discuss thulium silicate as a candidate dielectric for integration as interfacial layer, focusing on compatibility with the requirements in terms of both process integration and effects on electrical device characteristics. In particular, we demonstrate that thulium silicate provides advantages over conventional chemical oxide interfacial layers in terms of scalability and channel mobility.