Cite
Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress
MLA
N. D. Theodore, et al. “Failure Mechanisms of Pure Silver, Pure Aluminum and Silver–aluminum Alloy under High Current Stress.” Microelectronics Reliability, vol. 46, Dec. 2006, pp. 2096–103. EBSCOhost, https://doi.org/10.1016/j.microrel.2006.01.011.
APA
N. D. Theodore, E. Misra, James W. Mayer, & Terry Alford. (2006). Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress. Microelectronics Reliability, 46, 2096–2103. https://doi.org/10.1016/j.microrel.2006.01.011
Chicago
N. D. Theodore, E. Misra, James W. Mayer, and Terry Alford. 2006. “Failure Mechanisms of Pure Silver, Pure Aluminum and Silver–aluminum Alloy under High Current Stress.” Microelectronics Reliability 46 (December): 2096–2103. doi:10.1016/j.microrel.2006.01.011.