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Characterization and simulation of acid-catalyzed DUV positive photoresist

Authors :
Uwe Hollerbach
Steven A. Orszag
Nicholas K. Eib
Eytan Barouch
Source :
Advances in Resist Technology and Processing X.
Publication Year :
1993
Publisher :
SPIE, 1993.

Abstract

An investigation of the dissolution behavior of an acid catalyzed deep ultraviolet (DUV) positive resist has been completed. The immersion develop dissolution rate as a function of dose and post exposure bake temperature was measured by Perkin Elmer Dissolution Rate Monitor (DRM) for single layer resist on a silicon substrate. A reaction-diffusion model has been built to describe the dependence of development rate on exposure dose and post exposure bake (PEB) time/temperature. A mixed diffusion model has been built to account for catalyst diffusion and quenching. Developed images have been compared with simulated image quality, line width, and process window.© (1993) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Details

ISSN :
0277786X
Database :
OpenAIRE
Journal :
Advances in Resist Technology and Processing X
Accession number :
edsair.doi...........f8f15bc82d467f0b15fb848eb67ade81
Full Text :
https://doi.org/10.1117/12.154751