Back to Search Start Over

Build-Up Spiral and GND Vias for Improving Signal Integrity of Signal Core Vias

Authors :
Yi-Chuan Ding
Ming-Lung Kung
Yun-Hsiang Tien
Ken-Huang Lin
Hung-Hsiang Cheng
Liang-Yu Lin
Source :
IEEE Transactions on Components, Packaging and Manufacturing Technology. 11:2031-2034
Publication Year :
2021
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2021.

Subjects

Subjects :
Core (optical fiber)
Physics
Acoustics
Signal integrity
Electrical and Electronic Engineering
Spiral (railway)
Signal
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Details

ISSN :
21563985 and 21563950
Volume :
11
Database :
OpenAIRE
Journal :
IEEE Transactions on Components, Packaging and Manufacturing Technology
Accession number :
edsair.doi...........f6dfbb81c67e19612971644bcba8ee82
Full Text :
https://doi.org/10.1109/tcpmt.2021.3123943
Full Text Access
View/download PDF

Tools

Authors Abstract Subjects Details