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Electrical properties of a multilayer thin film substrate for multichip packages
- Source :
- Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium.
- Publication Year :
- 2003
- Publisher :
- IEEE, 2003.
-
Abstract
- The authors report the electrical properties of multilayer thin-film interconnects examined under circumstances in which the signal lines were sandwiched between mesh-pattern metal layers (called meshed stripline). Multilayer thin-film substrates with various transmission line structures were manufactured with several mesh patterns (power/ground planes) and signal lines, and the characteristic impedance and crosstalk for these lines were measured. The relations between the electrical properties and the meshed-stripline structures were obtained from the measurements for use in designing multilayer thin-film interconnects. It is shown that, in meshed-stripline structures, the characteristic impedance can be controlled by changing the aperture ratio or the mesh pitch. The fluctuation in the characteristic impedance along the signal-propagation direction was insignificant. It was also found that the crosstalk noise in meshed-stripline structures can be made as low as those in ordinary stripline structures. >
Details
- Database :
- OpenAIRE
- Journal :
- Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium
- Accession number :
- edsair.doi...........f6a6538bfc74a6d7fcaa9e786117b622