Boron Doping for p-Type β-FeSi2 Films by Sputtering Method

High quality epitaxial β-FeSi2 thin films prepared by alternate Fe/Si multilayers stacking were doped for p-type by co-sputtering of silicon and boron, in which elemental boron chips were placed on silicon target. The starting β-FeSi2 films before doping were n-type with residual electron concentration of about 2 ×1017 cm-3 and mobility of about 200 cm2/V·s. After doping with boron, β-FeSi2 films showed the same epitaxial crystallinity with continuous structure as that of non-doped one. Doping level of p-type β-FeSi2 films with net hole concentration from 3 ×1017 to 1 ×1019 cm-3 and mobility from 100 to 20 cm2/V·s were successfully achieved. Desired net hole concentration was obtained by varying the area ratio of boron chips on silicon target.