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The orientation relationships and interfaces of θ-Al2Cu/Cu and γ2-Al4Cu9/Cu and the formation sequence of θ-Al2Cu and γ2-Al4Cu9 at the Cu/Al interface
- Source :
- Thin Solid Films. 717:138436
- Publication Year :
- 2021
- Publisher :
- Elsevier BV, 2021.
-
Abstract
- The orientation relationships and interfacial planes of the theta (θ)-Al2Cu/Cu and gamma2 (γ2)-Al4Cu9/Cu interfaces formed on the Cu (001) and (111) surfaces have been studied by transmission electron microscopy (TEM). Epitaxial thin Cu films are grown on the single-crystal NaCl surfaces and then Al is evaporated to form θ-Al2Cu and γ2-Al4Cu9. Results showed that the θ-Al2Cu first formed and then the γ2-Al4Cu9 formed. The orientation relationships at the Al/Cu interface were found: (1) [110]θ//[111]Cu (zone axis) and ( 1 ¯ 10 ) θ // ( 1 ¯ 1 ¯ 2 ) Cu on the (111)Cu surface, (2) the (110)γ2 surface is the interface with both the Cu (001) and (111) surfaces with a common orientation relationship of ( 1 ¯ 11 ) γ2// ( 1 1 ¯ 0 ) Cu, and (3) [110]θ//[110]γ2 (zone axis) and ( 1 ¯ 10 ) θ// ( 1 ¯ 1 2 ¯ ) γ2 on the (111)Cu surface. The θ/Cu, γ2/Cu, and γ2/θ interfaces were further analyzed. The γ2-Al4Cu9 phase has good orientation relationships to Cu and therefore low interfacial energies. In addition, the energy of formation of γ2-Al4Cu9 is about 1.2 times than that of eta (η)-AlCu. Therefore γ2-Al4Cu9 nucleates first after θ-Al2Cu.
- Subjects :
- 010302 applied physics
Materials science
Zone axis
Metals and Alloys
02 engineering and technology
Surfaces and Interfaces
021001 nanoscience & nanotechnology
Epitaxy
01 natural sciences
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Orientation (vector space)
Crystallography
Transmission electron microscopy
Phase (matter)
0103 physical sciences
Materials Chemistry
0210 nano-technology
Subjects
Details
- ISSN :
- 00406090
- Volume :
- 717
- Database :
- OpenAIRE
- Journal :
- Thin Solid Films
- Accession number :
- edsair.doi...........f4ec4574b4205604bf0cfafbffd1d961
- Full Text :
- https://doi.org/10.1016/j.tsf.2020.138436