Demonstration of a 12 nm-half-pitch copper ultralow-k interconnect process

MLA

Christopher J. Jezewski, et al. “Demonstration of a 12 Nm-Half-Pitch Copper Ultralow-k Interconnect Process.” 2013 IEEE International Interconnect Technology Conference - IITC, June 2013. EBSCOhost, https://doi.org/10.1109/iitc.2013.6615593.

APA

Christopher J. Jezewski, Kanwal Jit Singh, Florian Gstrein, Robert B. Turkot, Richard E. Schenker, Rohan Akolkar, Jasmeet S. Chawla, Ramanan V. Chebiam, Hui Jae Yoo, M. Harmes, Gary Allen, James S. Clarke, Colin T. Carver, B. Krist, Hazel Lang, Tejaswi K. Indukuri, & Alan Myers. (2013). Demonstration of a 12 nm-half-pitch copper ultralow-k interconnect process. 2013 IEEE International Interconnect Technology Conference - IITC. https://doi.org/10.1109/iitc.2013.6615593

Chicago

Christopher J. Jezewski, Kanwal Jit Singh, Florian Gstrein, Robert B. Turkot, Richard E. Schenker, Rohan Akolkar, Jasmeet S. Chawla, et al. 2013. “Demonstration of a 12 Nm-Half-Pitch Copper Ultralow-k Interconnect Process.” 2013 IEEE International Interconnect Technology Conference - IITC, June. doi:10.1109/iitc.2013.6615593.