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Thermal Stress Evaluation of a Multifunctional Modular Multilevel Converter – STATCOM Operating as Active Filter

Authors :
R.O. de Sousa
Lenin Martins Ferreira Morais
Dayane do Carmo Mendonca
Heverton A. Pereira
Allan F. Cupertino
William Amorim
Source :
2019 IEEE 15th Brazilian Power Electronics Conference and 5th IEEE Southern Power Electronics Conference (COBEP/SPEC).
Publication Year :
2019
Publisher :
IEEE, 2019.

Abstract

The Modular Multilevel Converter (MMC) has proved to be an attractive technology in medium and high voltage Static Synchronous Compensator (STATCOM) applications. Nevertheless, once reactive power compensation profile is not constant over time, there are periods that a MMC-STATCOM works below its nominal capacity. In these periods, the converter can be used to perform ancillary services, such as Active Power Filtering. This paper analyzes the thermal stresses in the capacitors and semiconductor devices (i.e. IGBTs and diodes). The analyses take into account reactive compensation and harmonic current compensation of 5th and 7th harmonic components of a MMC based STATCOM. In addition, the limits of harmonic compensation for 5th and 7th harmonic orders are analytically derived. The results demonstrated lower thermal stresses during Active Power Filtering than the traditional STATCOM operation. Moreover, the 5th harmonic compensation is the most stressed one among the cases studied in this work.

Details

Database :
OpenAIRE
Journal :
2019 IEEE 15th Brazilian Power Electronics Conference and 5th IEEE Southern Power Electronics Conference (COBEP/SPEC)
Accession number :
edsair.doi...........f0662baa0aa0922ecdd2b907dfc4a347
Full Text :
https://doi.org/10.1109/cobep/spec44138.2019.9065465