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Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC

Authors :
D. Vogel
Reinhard Pufall
H. Rajendran
Bernhard Wunderle
Uwe Zschenderlein
Peter Ramm
Ole Holck
E. Auerswald
Source :
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Publication Year :
2014
Publisher :
IEEE, 2014.

Subjects

Subjects :
symbols.namesake
Materials science
Residual stress
Analytical chemistry
symbols
Raman spectroscopy
Micro structure

Details

Database :
OpenAIRE
Journal :
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
Accession number :
edsair.doi...........ee62318ca647588af0223a2ebe4d1267
Full Text :
https://doi.org/10.1109/ectc.2014.6897432
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