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Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/ <tex-math notation='LaTeX'>$\lambda $ </tex-math> Transmitter
- Source :
- IEEE Photonics Technology Letters. 27:1699-1701
- Publication Year :
- 2015
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2015.
-
Abstract
- We have achieved the 100-Gb/s/ $\lambda $ operation of a flip-chip interconnection 1.3- $\mu \text{m}$ lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-GBd 4-pulse-amplitude modulation operation after a 10-km single-mode fiber transmission.
- Subjects :
- Physics
Distributed feedback laser
Interconnection
Frequency response
business.industry
Transmitter
Bandwidth (signal processing)
Electrical engineering
Laser
Atomic and Molecular Physics, and Optics
Electronic, Optical and Magnetic Materials
law.invention
Modulation
law
Optoelectronics
Electrical and Electronic Engineering
business
Flip chip
Subjects
Details
- ISSN :
- 19410174 and 10411135
- Volume :
- 27
- Database :
- OpenAIRE
- Journal :
- IEEE Photonics Technology Letters
- Accession number :
- edsair.doi...........edb90e43f0297de7a3a9bae496164d47