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Optimization for Solder Joint Structure of Insulator Welding Through PCB

Authors :
Yangyang Li
Mingqi Gao
Dongyang Lei
Zeliang Wu
Yanming Zhang
Yuhua Pan
Source :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
Publication Year :
2022
Publisher :
IEEE, 2022.

Details

Database :
OpenAIRE
Journal :
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
Accession number :
edsair.doi...........edb8f826aa731483cec8540a28f2927f

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