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Effects of Surface Doping of Si Absorbers on the Band Alignment and Electrical Performance of TiO2-Based Electron-Selective Contacts
- Source :
- MRS Advances. 4:769-775
- Publication Year :
- 2019
- Publisher :
- Springer Science and Business Media LLC, 2019.
-
Abstract
- We have investigated the chemical and electrical properties of a thin SiO2/TiO2 stacking layer deposited on n-Si and heavily phosphorus-doped n++ Si substrates to elucidate effects of phosphorus doping of Si absorbers on the band alignment and electrical performance of a SiO2/TiO2 stack-based electron-selective contact deposited on the differently doped Si substrates. From our XPS study, we show a shift of the TiO2 energy levels up to ~0.13 eV with respect to those of Si as the doping level of Si substrates changes. We also show that the conduction band offset of the SiO2/TiO2 stacking layer at the interface with the n++ Si substrate seems to smaller than that of the SiO2/TiO2 stacking layer at the interface with n-Si substrate. Finally, from our electrical transport measurements, we could conclude that the thinner tunneling barrier, the increased electron density in front of the SiO2 layer in the n++ Si surface, and/or the reduced barrier height by heavy doping, seem to enhance the majority electron transport property of the SiO2/TiO2/n++ Si samples compared to that of the SiO2/TiO2/n-Si samples.
- Subjects :
- Electron density
Materials science
Mechanical Engineering
Doping
Stacking
Analytical chemistry
02 engineering and technology
Substrate (electronics)
Electron
010402 general chemistry
021001 nanoscience & nanotechnology
Condensed Matter Physics
01 natural sciences
0104 chemical sciences
X-ray photoelectron spectroscopy
Mechanics of Materials
General Materials Science
0210 nano-technology
Layer (electronics)
Quantum tunnelling
Subjects
Details
- ISSN :
- 20598521
- Volume :
- 4
- Database :
- OpenAIRE
- Journal :
- MRS Advances
- Accession number :
- edsair.doi...........ed551da78362b40807399b25f057655f
- Full Text :
- https://doi.org/10.1557/adv.2019.164