Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications

Authors :: Y.S. Huang
M.F. Shu
Y.H. Tseng
K.N. Chen
Y.P. Huang
S.L. Lu
Source :: Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials.
Publication Year :: 2015
Publisher :: The Japan Society of Applied Physics, 2015.

Database :: OpenAIRE
Journal :: Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials
Accession number :: edsair.doi...........ed542d584702b4d68c92c8cb14832752
Full Text :: https://doi.org/10.7567/ssdm.2015.e-6-3

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