Special bump bonding technique for silicon pixel detectors

This paper presents a high-density bumping technique based on electrodeposition of the bump materials. The idea of such technique is to allow the packaging of densely populated chips such as array pixel detectors. Silicon pixel detector dummies have been designed and fabricated at CNM in order to evaluate the technique developed. Special test structures have been included in these dummies to evaluate the final yield of the process developed at CNM. The foreseen applications are Medical Imaging and X-ray systems. The new bumping technique developed will greatly improve the simplicity and the cost of the packaging process.