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Joining of SiO2f/SiO2 composite to Nb using Ag-Cu-In-Ti brazing alloys
- Source :
- Journal of Materials Science & Technology. 50:13-20
- Publication Year :
- 2020
- Publisher :
- Elsevier BV, 2020.
-
Abstract
- Three compositions of Ag-Cu-In-Ti system brazing alloys were designed for joining SiO2f/SiO2 ceramic composite to Nb metal. The wettability of the three alloys on the composite was studied with the sessile drop method. The results showed that after heating at 1073 K for 30 min, they exhibited contact angles of 74°, 83° and 86°, respectively. The brazing alloys were fabricated into foils by rapid solidification technique. Among the three brazing filler alloys the joints brazed with AgCu-10In-5Ti at 1073 K for 10 min presented the maximum average shear strength of 30.9 MPa. During the brazing process the active element Ti diffused strongly from the filler alloy to the composite surface and a reaction layer with a thickness of 2–3 μm was formed. Sound metallurgical bonding was also achieved at the Nb side. The interface structure of the joint brazed with the AgCu-10In-5Ti alloy can be described as the following sequence: SiO2f/SiO2→SiO2+Cu3Ti3O→SiO2+TiO+Ti5Si4→Ag(s, s)+(Cu-Ti)→Nb. However, for the filler alloy with 4.0 wt% Ti content the joint strength was only 15.8 MPa.
- Subjects :
- Materials science
Polymers and Plastics
Alloy
Composite number
02 engineering and technology
engineering.material
010402 general chemistry
01 natural sciences
Metal
Contact angle
Sessile drop technique
Materials Chemistry
Shear strength
Brazing
Composite material
Mechanical Engineering
Metals and Alloys
021001 nanoscience & nanotechnology
0104 chemical sciences
Mechanics of Materials
visual_art
Ceramics and Composites
visual_art.visual_art_medium
engineering
Wetting
0210 nano-technology
Subjects
Details
- ISSN :
- 10050302
- Volume :
- 50
- Database :
- OpenAIRE
- Journal :
- Journal of Materials Science & Technology
- Accession number :
- edsair.doi...........ecaa7578c88196896670ef082e9d50de
- Full Text :
- https://doi.org/10.1016/j.jmst.2019.08.002