Erratum: 'Thermomigration in flip-chip SnPb solder joints under alternate current stressing' [Appl. Phys. Lett. 90, 152105 (2007)]

Subjects

Subjects :

Materials science
Physics and Astronomy (miscellaneous)
business.industry
Soldering
Metallurgy
Optoelectronics
Alternate current
business
Electromigration
Current density
Flip chip

Details

ISSN :

10773118 and 00036951

Volume :

90

Database :

OpenAIRE

Journal :

Applied Physics Letters

Accession number :

edsair.doi...........ec76c6281ade5e70ae2713c2a649c524

Full Text :

https://doi.org/10.1063/1.2748851