Thinner Package Process for High Band Width Flip Chip CSP

Flip chip ball grid array on strip (FCCSP) has been found in wide range such as telecommunication, computer, and workstation application because it provided solutions for high speed demand, high input/output (I/0) density, and high electrical performance requirement. Due to the trend of thinner and smaller of future PKG, the higher technology of assembly is required. High Band Width FCCSP (HBW) structure is the high-end product nowadays. This product is almost applied on mobile or pad, so total thickness will play an important role of end product’s total thickness. In conclusion, this experiment is to thin the thickness from 680um (include ball height) to be less than 500 or 400um based on HBW structure for customer’s future requirement.