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Thermal science and engineering in third-generation semiconductor materials and devices
- Source :
- Acta Physica Sinica. 70:1-5
- Publication Year :
- 2021
- Publisher :
- Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences, 2021.
Details
- ISSN :
- 10003290
- Volume :
- 70
- Database :
- OpenAIRE
- Journal :
- Acta Physica Sinica
- Accession number :
- edsair.doi...........eb7a70705a39cde8e3c2211fa5e7f9e2