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Thermal science and engineering in third-generation semiconductor materials and devices

Authors :
Cheng Zhe
Source :
Acta Physica Sinica. 70:1-5
Publication Year :
2021
Publisher :
Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences, 2021.

Details

ISSN :
10003290
Volume :
70
Database :
OpenAIRE
Journal :
Acta Physica Sinica
Accession number :
edsair.doi...........eb7a70705a39cde8e3c2211fa5e7f9e2