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Investigation of hygrothermally induced failures in multilayer ceramic capacitors during thermal reflow process
- Source :
- Microelectronics Reliability. 146:115028
- Publication Year :
- 2023
- Publisher :
- Elsevier BV, 2023.
Details
- ISSN :
- 00262714
- Volume :
- 146
- Database :
- OpenAIRE
- Journal :
- Microelectronics Reliability
- Accession number :
- edsair.doi...........eb250757c971578a28e0751f1d8b73b7