Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler

Authors :: G. H. Pan
L. C. Tsao
M. J. Chiang
T. H. Chuang
S. Y. Chang
C. N. Tung
Source :: Journal of Materials Engineering and Performance. 12:383-389
Publication Year :: 2003
Publisher :: Springer Science and Business Media LLC, 2003.
Abstract: Indium tin oxide (ITO) ceramics are bonded with ITO and Cu at 250 °C in air using an active solder Sn3.5Ag4Ti(Ce, Ga). The mechanism for such low temperature soldering of ITO ceramics in air has been investigated. Electron probe microanalyzer (EPMA) analyses reveal that the element oxygen distributes uniformly within the solder matrix after soldering, while Ti segregates effectively at the ITO/solder and Cu/solder interfaces at such a low temperature, giving satisfactory joining results of Cu/Cu, ITO/ITO, and ITO/Cu in air.

Subjects :: Filler (packaging)
Materials science
Mechanical Engineering
Metallurgy
chemistry.chemical_element
Electron microprobe
Oxygen
Solder matrix
Copper
Indium tin oxide
chemistry
Mechanics of Materials
visual_art
Soldering
visual_art.visual_art_medium
General Materials Science
Ceramic
Composite material

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