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Investigation Regarding Temperature Prediction Accuracy of Discrete Power Semiconductor Package Models
- Source :
- 2023 International Conference on Electronics Packaging (ICEP).
- Publication Year :
- 2023
- Publisher :
- IEEE, 2023.
Details
- Database :
- OpenAIRE
- Journal :
- 2023 International Conference on Electronics Packaging (ICEP)
- Accession number :
- edsair.doi...........e70e03250748b9cc5993c73d6c704765
- Full Text :
- https://doi.org/10.23919/icep58572.2023.10129681