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Nondestructive Monitoring of Die Warpage in Encapsulated Chip Packages
- Source :
- IEEE Transactions on Components, Packaging and Manufacturing Technology. 6:653-662
- Publication Year :
- 2016
- Publisher :
- Institute of Electrical and Electronics Engineers (IEEE), 2016.
-
Abstract
- We describe an X-ray diffraction imaging technique for nondestructive, in situ measurement of die warpage in encapsulated chip packages at acquisition speeds approaching real time. The results were validated on a series of samples with known inbuilt convex die warpage, and the measurement of wafer bow was compared with the results obtained by optical profilometry. We use the technique to demonstrate the impact of elevated temperature on a commercially sourced micro quad flat nonlead chip package and show that the strain becomes locked in at a temperature between 94 °C and 120 °C. Using synchrotron radiation at the Diamond Light Source, warpage maps for the entire $2.2~\textrm {mm} \times 2.4~\textrm {mm} \times 150$ - $\mu \text{m}$ Si die were acquired in 50 s, and individual line scans in times as short as 500 ms.
- Subjects :
- Diffraction
Materials science
Silicon
business.industry
020208 electrical & electronic engineering
Diamond
chemistry.chemical_element
Synchrotron radiation
02 engineering and technology
engineering.material
021001 nanoscience & nanotechnology
Chip
Temperature measurement
Industrial and Manufacturing Engineering
Die (integrated circuit)
Electronic, Optical and Magnetic Materials
chemistry
0202 electrical engineering, electronic engineering, information engineering
engineering
Optoelectronics
Integrated circuit packaging
Electrical and Electronic Engineering
0210 nano-technology
business
Subjects
Details
- ISSN :
- 21563985 and 21563950
- Volume :
- 6
- Database :
- OpenAIRE
- Journal :
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Accession number :
- edsair.doi...........e5a1c8baf948b4d41bfced5f90a23d6c