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Improved strength of boron-doped Sn-1.0Ag-0.5Cu solder joints under aging conditions
- Source :
- Intermetallics. 20:155-159
- Publication Year :
- 2012
- Publisher :
- Elsevier BV, 2012.
-
Abstract
- The mechanical properties of new lead-free Sn–Ag–Cu solder alloys containing 0.05–0.1 wt.% boron were investigated under a range of isothermal aging and reflow conditions. The boron-doped solder joints showed higher ball pull strength than the baseline Sn-1.0Ag-0.5Cu solder joint under all isothermal aging and reflow conditions examined. In particular, the high-speed ball pull strength of the 0.05 wt.% B-doped solder joint was approximately 2.5 times greater than that of the baseline Sn-1.0Ag-0.5Cu solder joint aged at 150 °C for 200 h, which is attributed mainly to the reduced rate of grain growth in the intermetallic compound (IMC) layers of B-doped solder joints under aging conditions.
Details
- ISSN :
- 09669795
- Volume :
- 20
- Database :
- OpenAIRE
- Journal :
- Intermetallics
- Accession number :
- edsair.doi...........e4fc734ff3f5bce5383d6434081cc6d9