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Cost-effective Means to Improve Barrier Performance of Ti in Cu-TSVs for 3D Integration

Authors :
J. Bea
Murugesan Mariappan
T. Fukushima
M. Koyanagi
Source :
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials.
Publication Year :
2016
Publisher :
The Japan Society of Applied Physics, 2016.

Details

Database :
OpenAIRE
Journal :
Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials
Accession number :
edsair.doi...........e412311cfe77a813baad4499faca3500

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