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Process Considerations for Screen-Printed Thick-Film MEMS

Authors :
I. Stanimirovic
Z. Stanimirovic
Source :
2021 IEEE 32nd International Conference on Microelectronics (MIEL).
Publication Year :
2021
Publisher :
IEEE, 2021.

Abstract

This paper discusses the use of thick-film screen-printing process in realization of micro-electro-mechanical systems (MEMS). Two types of screen-printed thick-film MEMS are taken in consideration: screen-printed silicon and screen-printed ceramic MEMS. Silicon MEMS dominate MEMS market and screen-printed silicon MEMS are mostly based on piezoelectric thick films such as lead zirconate titanate (PZT). Key issues that screen-printed silicon MEMS face are compatibility of materials and processes used in their realization. Screen-printed ceramic MEMS are MEMS with free-standing micromechanical structures on top surface of the ceramic substrate and L TCC based ceramic MEMS. Challenges for screen-printed ceramic MEMS are related to compatibility of thick - film compositions, screen printing and micromachining processes used for realization of these fragile microstructures.

Details

Database :
OpenAIRE
Journal :
2021 IEEE 32nd International Conference on Microelectronics (MIEL)
Accession number :
edsair.doi...........e24c9d2a84586c378df59b5e4491142b