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Semiconductor Package Modeling at JEITA and Extension to IEC Standard
- Source :
- Journal of The Japan Institute of Electronics Packaging. 24:188-192
- Publication Year :
- 2021
- Publisher :
- Japan Institute of Electronics Packaging, 2021.
Details
- ISSN :
- 1884121X and 13439677
- Volume :
- 24
- Database :
- OpenAIRE
- Journal :
- Journal of The Japan Institute of Electronics Packaging
- Accession number :
- edsair.doi...........e123d07f2a70f67c65c9929ff1be1cc7
- Full Text :
- https://doi.org/10.5104/jiep.24.188