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Semiconductor Package Modeling at JEITA and Extension to IEC Standard

Authors :
Yutaka Kumano
Takuya Shinoda
Koji Nishi
Ken Miyazaki
Source :
Journal of The Japan Institute of Electronics Packaging. 24:188-192
Publication Year :
2021
Publisher :
Japan Institute of Electronics Packaging, 2021.

Details

ISSN :
1884121X and 13439677
Volume :
24
Database :
OpenAIRE
Journal :
Journal of The Japan Institute of Electronics Packaging
Accession number :
edsair.doi...........e123d07f2a70f67c65c9929ff1be1cc7
Full Text :
https://doi.org/10.5104/jiep.24.188