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In-Situ Ultrasonic Inspection of Thickness and Morphology of Thermal Interface Material in Multilayer Structure Using Modified Minimum Entropy Deconvolution

Authors :
Shifeng Guo
Yangyang Huang
Dan Chen
Linlin Ren
Dawei Wang
Wei Feng
Source :
IEEE Transactions on Instrumentation and Measurement. 71:1-10
Publication Year :
2022
Publisher :
Institute of Electrical and Electronics Engineers (IEEE), 2022.

Subjects

Subjects :
Electrical and Electronic Engineering
Instrumentation

Details

ISSN :
15579662 and 00189456
Volume :
71
Database :
OpenAIRE
Journal :
IEEE Transactions on Instrumentation and Measurement
Accession number :
edsair.doi...........e0ea18afcd7ec84f61dfa8678ace5783

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