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Fast diffusers in a thermal gradient (solder ball)

Authors :
K.J. Ryan
B.H. Wood
N.A. Connelly
Xiaoli He
James R. Lloyd
Source :
Microelectronics Reliability. 50:1355-1358
Publication Year :
2010
Publisher :
Elsevier BV, 2010.

Abstract

The behaviour of Ni in Sn under a thermal gradient driving forces was calculated considering boundary conditions typical of lead-free solder applications. The steady state concentration profiles for a fast diffuser were determined and the consequences for reliability discussed.

Subjects

Subjects :
Materials science
Metallurgy
Mechanical engineering
Solder ball
Condensed Matter Physics
Atomic and Molecular Physics, and Optics
Surfaces, Coatings and Films
Electronic, Optical and Magnetic Materials
Temperature gradient
Reliability (semiconductor)
Soldering
Boundary value problem
Electrical and Electronic Engineering
Diffuser (sewage)
Safety, Risk, Reliability and Quality

Details

ISSN :
00262714
Volume :
50
Database :
OpenAIRE
Journal :
Microelectronics Reliability
Accession number :
edsair.doi...........dfcfb00d1c6b8a12c900ff257df83195
Full Text :
https://doi.org/10.1016/j.microrel.2010.07.067
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