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Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Authors :
Jeong Won Yoon
Sang Won Kim
Seung Boo Jung
Publication Year :
2005
Publisher :
Trans Tech Publications Ltd., 2005.

Details

Database :
OpenAIRE
Accession number :
edsair.doi...........de9fa6e8c9cc909299f19cef7dd4bccc

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