Fabrication of micro-photonic devices using embossing technique

We report that it was successful to use thermal and UV embossing techniques for the fabrication of 1310/1550nm directional coupler demultiplexer and 1x4 MMI optical power splitter, respectively. The mold was prepared with a poly-dimethylsiloxane (PDMS) elastomer, and the pattern was transferred from the photoresist. We experimented also on the durability of the PDMS mold and successfully fabricated 50th replica with thermal curable polymer and 17th replica with UV curable polymer, respectively.