Appliqué: A Computationally Efficient Modeling Tool For Multi-Layer Printed Inductors, For Near Field Wireless Power Transfer Applications

This paper presents Applique, a computationally efficient open source environment for wireless power transfer coil design. The system allows designers to rapidly design and simulate coils. Applique extracts coil parameters and backannotates the extracted values into a SPICE netlist model of the wireless power transfer coil. Applique then automatically executes SPICE and combines extracted inductances, capacitances, and resistances to provide the user with narrow or wideband impedance analysis, as well as component values for a functionally meaningful simplified circuit model. Final designs may then be exported to common PCB CAD software.