Recent advances on SnBi low-temperature solder for electronic interconnections

MLA

Xiao-Guo Song, et al. “Recent Advances on SnBi Low-Temperature Solder for Electronic Interconnections.” Journal of Materials Science: Materials in Electronics, vol. 32, Aug. 2021, pp. 22731–59. EBSCOhost, https://doi.org/10.1007/s10854-021-06820-7.

APA

Xiao-Guo Song, Nan Jiang, Lei Zhang, Peng He, & Li-li Gao. (2021). Recent advances on SnBi low-temperature solder for electronic interconnections. Journal of Materials Science: Materials in Electronics, 32, 22731–22759. https://doi.org/10.1007/s10854-021-06820-7

Chicago

Xiao-Guo Song, Nan Jiang, Lei Zhang, Peng He, and Li-li Gao. 2021. “Recent Advances on SnBi Low-Temperature Solder for Electronic Interconnections.” Journal of Materials Science: Materials in Electronics 32 (August): 22731–59. doi:10.1007/s10854-021-06820-7.