In-Situ Control of Defect Dynamics By Ellipsometry During Ion Implantation – Evolution of Disorder and Cavity Structure in Single-Crystalline Ge During Implantation of Sb Ions

Ion implantation has been a key technology in microelectronics and generally, for the controlled surface modification of materials for tribology, biocompatibility, corrosion resistance and many more. In this work in-situ spectroscopic ellipsometry was used for accurately tracking and on-line evaluating the accumulation of voids and damage in crystalline Ge during implantation of 200-keV Sb+ ions at a total fluence of 1016 cm− 2 using an ion flux of 2.1 × 1012 cm− 2s− 1. The phases of damage accumulation were identified using unique optical multi-layer models describing the layer structure and composition. The formation of initial partial disorder was followed by complete amorphization and void formation occurring at the fluence of 1 × 1015 cm− 2, reaching a high volume fraction of voids and a layer thickness of ≈ 200 nm by the end of the process. This agrees with numerical simulations and results of complementary measurements including ion beam analysis and electron microscopy. The developed in-situ method for controlling the dynamics of structural damage accumulation is a versatile ion-implantation tool for avoiding adverse void formation and for controlled evolution of subsurface nanocavities or cellular surface texture alike.