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9.2: Sequential Lateral Solidification (SLS) Process for Large Area AMOLED

Authors :
Seong Hyun Jin
Young-Jin Chang
In-Do Chung
Jun-Hyung Souk
Beom-Rak Choi
Jae Beom Choi
Ji-Hye Eom
Young-Il Kim
Hyung Don Na
Chi-Woo Kim
Baehyun Jung
Young-Rok Song
Hyo-Seok Kim
Cheol-Ho Park
Kyong-Tae Park
Yangsun Kim
Kee-Chan Park
Source :
SID Symposium Digest of Technical Papers. 39:97
Publication Year :
2008
Publisher :
Wiley, 2008.

Abstract

We have demonstrated that the sequential lateral solidification (SLS) technology can be utilized for the large area AMOLED. An optimized SLS process provides us with polycrystalline Si films with well-controlled grain size and location. The thin film transistors (TFTs) with SLS-processed Si films show high performance with desirable uniformity. 14″ WXGA (1280×RGB×768) AMOLEDs were fabricated with SLS-processed TFT backplanes. We utilized RGB evaporation process with fine metal mask. The novel delta pixel arrangement results in increased aperture ratio and wider FMM process window. The advantage of SLS process will be discussed.

Details

ISSN :
0097966X
Volume :
39
Database :
OpenAIRE
Journal :
SID Symposium Digest of Technical Papers
Accession number :
edsair.doi...........d98f23ccab9f098f958fbd78d7e128ac
Full Text :
https://doi.org/10.1889/1.3069845