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Millimeter-Wave Band CMOS RF Phased-Array Transceiver IC Designs for 5G Applications

Authors :
Won-Sok Lee
Duhyun Lee
Sang Ho Jeon
Son Juho
D. Minn
Dae-Woong Kang
Sung-Gi Yang
Y. Aoki
J. Jang
Ki-chul Kim
Hyun-Chul Park
Jung-hyeon Kim
Soon-yeon Park
S. Kim
J. H. Lee
J.M. Park
B.S. Suh
M. Kim
Chung-woo Kim
Jung-Hyoung Lee
Kyung-Hoon Min
A.-S. Ryu
Young-Wug Kim
S.Y. Lee
Source :
2020 IEEE International Electron Devices Meeting (IEDM).
Publication Year :
2020
Publisher :
IEEE, 2020.

Abstract

This paper presents design challenges and solutions for the fifth generation (5G) phased-array transceiver ICs in millimeter-wave (MMW) frequency bands. A 28nm bulk CMOS device technology is selected to integrate multiple RF phased-array elements in a single-chip to achieve a high-level of TX EIRP and RX sensitivity. Several design approaches of gain, P OUT , stability, reliability and linearity enhancement techniques are applied to enable CMOS as a key device solution for 5G applications in MMW frequency bands. A 39GHz band 16-channel CMOS RF phased-array transceiver IC is designed and can support 4T/4R MIMO base-station applications including ×64 RF phased-array ICs (total 1,024 phased-array elements). T/RX paths have gain dynamic ranges of >30/40dB for flexibility and scalability. The TX path shows P OUT /Ch. of >6.0dBm at EVM of -34dB (800MHz) and P DC /Ch. of 105mW. The RX path performs NF of 4.2dB, EVM of -38dB (100MHz) and P DC /Ch. of 39mW. These state-of-the-art results lead to TX EIRP of >55dBm and RX sensitivity of

Details

Database :
OpenAIRE
Journal :
2020 IEEE International Electron Devices Meeting (IEDM)
Accession number :
edsair.doi...........d86ad2928f3bbabca4604eaa3f43d36b