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Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards

Authors :
Yohei Ito
Kenjiro Takanishi
Tatsuya Sakamoto
Keisuke Fujiwara
Hitoshi Arai
Source :
The Proceedings of the Thermal Engineering Conference. 2020:0042
Publication Year :
2020
Publisher :
Japan Society of Mechanical Engineers, 2020.

Details

ISSN :
2424290X
Volume :
2020
Database :
OpenAIRE
Journal :
The Proceedings of the Thermal Engineering Conference
Accession number :
edsair.doi...........d70a4b8fc85c1c9038d51488c58bd0ed
Full Text :
https://doi.org/10.1299/jsmeted.2020.0042