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Development of High Heat Dissipation and Low Thermal Expansion Printed Circuit Boards
- Source :
- The Proceedings of the Thermal Engineering Conference. 2020:0042
- Publication Year :
- 2020
- Publisher :
- Japan Society of Mechanical Engineers, 2020.
Details
- ISSN :
- 2424290X
- Volume :
- 2020
- Database :
- OpenAIRE
- Journal :
- The Proceedings of the Thermal Engineering Conference
- Accession number :
- edsair.doi...........d70a4b8fc85c1c9038d51488c58bd0ed
- Full Text :
- https://doi.org/10.1299/jsmeted.2020.0042